Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
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DISCO
DAD3350
Verified
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116466
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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DISCO
DAD3350
CATEGORY
Scribing, Cutting, Dicing
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116466
Wafer Sizes:
4"/100mm, 5"/125mm, 6"/150mm, 8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Wafer Dicing Mode: Semi-autoOEM Model Description
The Disco DAD3350 is an automatic dicing saw that supports a wide range of applications. It is capable of handling a maximum of Φ8-inch or 250 x 250 mm workpieces (user-specified specification). A 1.8 kW spindle is equipped as standard. By selecting a 2.2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic.Documents
No documents