Description
No spare parts missingConfiguration
The following are the operating specifications for the Heatpulse® 8108 system. * Wafer handling: automatic serial processing, using standard cassettes. * Throughput: Process dependent, approximately 80 wafers per hour (in a null cycle) without flat-finder. * Wafer sizes: 5 inches, 6 inches, and 8 inches (standard). * Ramp-up rate: Programmable, 1 - 180°C per second. * Steady-state duration: 1 - 600 seconds per step. * Ramp-down rate: Programmable, 1 - 180°C per second. Ramp-down rate is temperature and radiation dependent, maximum 150°C per second. * Recommended steady-state temperature range: 400 - 1200°C. * ERP temperature accuracy: +3°C to -7°C, when calibrated against an instrumented thermocouple wafer (ITC). * Temperature repeatability: ±3°C or better at 1150°C wafer to wafer. (Repetition specifications are based on a 100-wafer set.) * Temperature uniformity: ±5°C across an 8-inch wafer at 1150°C. (This is a 1-sigma deviation from 100-angstrom oxide uniformity.) For a titanium silicidation process, no more than 1.5 percent increase to uniformity during the first anneal at 650 - 700°C.OEM Model Description
Rapid Thermal Processor The AG Associates Heatpulse 8108 system is a single-wafer, cassette-to-cassette rapid thermal processor, capable of processing in inert or corrosive ambients. The system is built for the production environment.Documents
CATEGORY
RTP/RTA
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136446
Wafer Sizes:
5"/125mm, 6"/150mm, 8"/200mm
Vintage:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
METRON / AG ASSOCIATES
HEATPULSE 8108
CATEGORY
RTP/RTA
Last Verified: 20 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136446
Wafer Sizes:
5"/125mm, 6"/150mm, 8"/200mm
Vintage:
1995
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available