Description

No missing parts

Configuration

It configures two PVD and one Etch chamber two PVD chambers , one Etch chamber , two Load Lock chambers ,one Transfer chamber Configuration(upper floor) 2 L/L(VCB), 1 Transfer Chamber, 2 Depo(Sputter), 1 Etch(HSE), 3 Controller Raack (AC Power, DC power Supply, Vacuum Cont, Controller) Down Floor 2 Cryo Compressor(CTI 9600), 4 Dry Pump(SDE90), 2 Chiller 470VAC Transformer, Failure ・L/L(VCB) Contrtoller VCB BàDoor Close failure and Switching from Rough to Turbo ・Etch CH（HSE）Controller à Switch to Depo A ESC for Depo A does not work but new spare ESC available. Broken parts (TMP for Loadlock chamber ,Transfer chamber)

OEM Model Description

The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.