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Description
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SPTS Sigma fxP PVD 5 metal sputter chamber + 1 HSE chamber TiW/Ta/Moly/Au/Ti sputtering chamber and Plasma cleaning chamber 6 in WaferOEM Model Description
The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.Documents
No documents
PREFERRED
SELLER
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116036
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
SELLER
KLA / SPTS
SIGMA fxP
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Buyer pays 12% premium of final sale price
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116036
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
SPTS Sigma fxP PVD 5 metal sputter chamber + 1 HSE chamber TiW/Ta/Moly/Au/Ti sputtering chamber and Plasma cleaning chamber 6 in WaferOEM Model Description
The SPTS Sigma FxP is a physical vapor deposition (PVD) system for 4-12" power device manufacturing. Applications fo the SPTS Sigma FxP include frontside thick Al and thin wafer backside processing. The Sigma fxP carries thin wafer handling hardware and uses film deposition stress control techniques to deliver high throughput processes with low wafer bow. Sigma fxP - a cluster system supporting up to 6 PVD chambers (including associated pre-clean/degas module options). The fxP is an 8-sided cluster system supporting up to 6 process modules for the ultimate in throughput, availability and productivity.Documents
No documents