EVATEC / UNAXIS / OERLIKON / BALZERS CLUSTERLINE 200

Description

The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers. Handler Type MX800. 5x Pulsed DC chambers with RF on Chuck