EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200 

AlCu & Ti sputter deposition cluster tool

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Last processed 6” wafer was Oct’21, currently the tool is not running with power-off condition.

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The Clusterline 200 systems offeredis equipped with 5 single process chambers each. They were used only for reactive sputtering of SiO2 layers on 150mm blank Si wafers. Both systems are still in a clean room and in working conditions. Further devices mounted on these tools are: two vacuum loadports each, wafer aligners, buffer stations for upto 5 wafers, OCR back side readers.

Handler Type MX800.







5x Pulsed DC chambers with RF on Chuck

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Metal sputtering machine
Metal thin film (sputtering)

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CLUSTERLINE 200

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EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

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EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200

EVATEC / UNAXIS / OERLIKON / BALZERS

CLUSTERLINE 200