Description
AMAT Endura II Metal Deposition Platform Copper Barrier Seed SystemConfiguration
No ConfigurationOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents
CATEGORY
PVD / Sputtering
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136331
Wafer Sizes:
12"/300mm
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
ENDURA II
CATEGORY
PVD / Sputtering
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136331
Wafer Sizes:
12"/300mm
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
AMAT Endura II Metal Deposition Platform Copper Barrier Seed SystemConfiguration
No ConfigurationOEM Model Description
The Applied Materials ENDURA II is a highly advanced platform used in the semiconductor industry for physical vapor deposition (PVD) processes. It is designed to deposit thin films of various materials onto semiconductor wafers with exceptional precision and uniformity.Documents
No documents