Description
Production Wafer ProberConfiguration
No ConfigurationOEM Model Description
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.Documents
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TEL / TOKYO ELECTRON
CELLCIA
Verified
CATEGORY
Probers
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
98147
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
CELLCIA
Verified
CATEGORY
Probers
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
98147
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Production Wafer ProberConfiguration
No ConfigurationOEM Model Description
There are an increasing variety of test requirements in conjunction with diversified device design, device application, process node shrink and package design complexity. To reduce total test cost, especially in Memory applications, multi-site probe cards were introduces as a way of reducing test cost. This method found its limit when single wafer/one-touch-down probe card technology appeared. Cellcia™ is a breakthrough technology. Splitting wafer lots into the Cellcia™ multi-cell probe system, reduces test turn-around-time and improves system footprint by adopting a multi-layer structure. Conventional prober technology cannot achieve the Cellcia™ throughput with similar floor space. The Cellcia™ system maximizes test efficiency and minimizes total test cost. TEL has combined its vast wafer probe experience and front-end process technologies to develop the world’s leading probe system, Cellcia™.Documents
No documents