
Description
HDD and software will be included Docking Type (Not including Docking Interface): ST6730A OS: S7.39 FC Hinge: MHF4000S Auto Card Change: O Stage unit - Chuck: Nickel Chuck Stage unit - Temp contr: Hot Chuck Stage unit - Chuck Temp: 30°C ~ 150°C Cleaning unit: O Others - Tester I/F: GPIB Others - OCR: O Others - Inker: O Others - Ethernet: OConfiguration
No ConfigurationOEM Model Description
The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.Documents
No documents
Verified
CATEGORY
Probers
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Down
Product ID:
137237
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllACCRETECH / TSK
UF2000
CATEGORY
Probers
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Installed / Down
Product ID:
137237
Wafer Sizes:
Unknown
Vintage:
2010
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
HDD and software will be included Docking Type (Not including Docking Interface): ST6730A OS: S7.39 FC Hinge: MHF4000S Auto Card Change: O Stage unit - Chuck: Nickel Chuck Stage unit - Temp contr: Hot Chuck Stage unit - Chuck Temp: 30°C ~ 150°C Cleaning unit: O Others - Tester I/F: GPIB Others - OCR: O Others - Inker: O Others - Ethernet: OConfiguration
No ConfigurationOEM Model Description
The ACCRETECH / TSK UF2000 is a probing machine for 200mm wafers. It is a high precision, high rigidity machine that offers a variety of options for wafer test. Some of the options include testing environments that can adopt from ultrahigh to low temperature, transfer of warpage and ultrathin wafer by the special transfer mechanism, and a low noise testing environment.Documents
No documents