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ACCRETECH / TSK UF200
    Description
    No description
    Configuration
    -Number of Cassette Elevators 2 -Wafer Handling - Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 200.0000 in (5,080.00 mm) -Plating Material Nickel/Gold Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions: Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM Model Description
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
    Documents

    No documents

    ACCRETECH / TSK

    UF200

    verified-listing-icon

    Verified

    CATEGORY
    Probers

    Last Verified: Over 30 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    101930


    Wafer Sizes:

    6"/150mm, 8"/200mm


    Vintage:

    2000

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    ACCRETECH / TSK UF200

    ACCRETECH / TSK

    UF200

    Probers
    Vintage: 1999Condition: Used
    Last Verified7 days ago

    ACCRETECH / TSK

    UF200

    verified-listing-icon
    Verified
    CATEGORY
    Probers
    Last Verified: Over 30 days ago
    listing-photo-a5a1e80946594c4f93d891e09a4c48d1-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/53724/a5a1e80946594c4f93d891e09a4c48d1/e95e3e88f9b340fa8f0ec97b22026520_6091ce5e840c4659be1bc836ae1aba8d1201a_mw.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    101930


    Wafer Sizes:

    6"/150mm, 8"/200mm


    Vintage:

    2000


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    -Number of Cassette Elevators 2 -Wafer Handling - Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 200.0000 in (5,080.00 mm) -Plating Material Nickel/Gold Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions: Width 42.992 in (109.2 cm) Depth 43.346 in (110.1 cm) Height 34.921 in (88.7 cm) Weight 1,764 lb (800 kg)
    OEM Model Description
    The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.
    Documents

    No documents

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    ACCRETECH / TSK UF200

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    ACCRETECH / TSK UF200

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