Description
No descriptionConfiguration
-Number of Cassette Elevators 2 -Wafer Handling Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions -Width 42.992 in (109.2 cm) -Depth 43.346 in (110.1 cm) -Height 34.921 in (88.7 cm) -Weight 1,764 lb (800 kg)OEM Model Description
The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.Documents
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ACCRETECH / TSK
UF200
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101934
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllACCRETECH / TSK
UF200
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101934
Wafer Sizes:
6"/150mm, 8"/200mm
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-Number of Cassette Elevators 2 -Wafer Handling Random Access Robot -Accuracy ± 2.00 % Vacuum Chuck -Diameter 7.8740 in (200.00 mm) -Plating Material Nickel/Gold -Temperature Controlled Chuck YES -Automatic Alignment YES -OCR Camera YES -Probe Mark Inspection YES -Software Revision Level 6G.16.AB -Interface IEEE 488-GPIB -Power Requirements 220/240 V 20.0 A 50/60 Hz 1 Phase -CE Marked YES -External Cooling Air Cooled -Operating Air Pressure 58.00 PSI (399,927.40 N/sq m) -Air Consumption 10.00 CFM (0.28 cu m/min) -Vacuum Required -23.00 in Hg (-584.19 mm Hg) Exterior Dimensions -Width 42.992 in (109.2 cm) -Depth 43.346 in (110.1 cm) -Height 34.921 in (88.7 cm) -Weight 1,764 lb (800 kg)OEM Model Description
The Accretech UF200 Wafer probing machine is a highly advanced tool with a capacity of 2000 pins. It utilizes Moire scale in the AC servo motor closed-loop control system to achieve fast and precise positioning, boasting a stage accuracy of 2 µm. This machine represents a significant advancement in wafer probing technology, offering users efficient and accurate performance for their probing needs.Documents
No documents