Description
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The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
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DISCO
DGP8760
Verified
CATEGORY
Polishing and Grinding
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75869
Wafer Sizes:
Unknown
Vintage:
Unknown
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DISCO
DGP8760
Verified
CATEGORY
Polishing and Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
75869
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents