Description
Fully automatic in-feed surface grinder/polisherConfiguration
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents
DISCO
DGP8760
Verified
CATEGORY
Polishing and Grinding
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72740
Wafer Sizes:
6"/150mm
Vintage:
2009
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
DISCO
DGP8760
Verified
CATEGORY
Polishing and Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72740
Wafer Sizes:
6"/150mm
Vintage:
2009
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Fully automatic in-feed surface grinder/polisherConfiguration
- Turntable for Chuck Tables 3 axis with 3 low vibration air bearing spindles (3rd axis for stress relief) - Stress relief specifications (Z3-axis): Poli-Grind Robotic Wafer Transportation system - Vacuum Pump System height gauges probe for measuring operation panel and video display unit - GUI 6" Chuck Table 6" Spinner Table Z1 and Z2 Grinding Wheel Z3 Poli-Grind Polishing Wheel Transformer, Signal Tower - Height gauge for 6" robot hand, 6" T2 Pad, 6" cassette stage, 6" process software modification - Atomizing wafer edge cleaningOEM Model Description
The DGP8760 is a fully automatic grinder/polisher for Φ300 mm wafers developed by DISCO Corporation. It is the predecessor to the DGP8761, which integrates backside grinding and stress relief processing and performs stable thin grinding to thicknesses less than 25 µm.Documents
No documents