Description
Single Wafer ProcessingConfiguration
Process: BACKETCH Tool config is based on original PO, please verify tool details at tool inspection FID: 157426 Tool S/N: E14 Reference Tool S/N: E6 EOS Product Type EOS Front Section ES EOS Rear Section ES Front End Load Port: 4 FOUP TDK Carrier ID: Brooks Carrier ID reader Factory Automation: OHT PIO Sensor User Interface Options: Side Only (Ballroom) Signal Tower: R-O-G-B Silm Line Handling system: Standard Handling Process Module Ionization: PM Ionixation 16 chamber Platform Doors: Door with Windows Okatform Lights: Wite LEDs Number of Power Supply Lines: 2 Supply Feed System Power Supply: 208V and 480V 50/60 Hz Interconnect Com. Cables: 30m Cab;es to Subpanel PC Power supply: Internal UPS Fire Suppression Front Section & Rear Section EOS ES Media#1 Chemistry 1: dHF (supply to TL) Chemistry 1 Dispense: double side dispense Chemistry 1 Dispense mode: Drain & recirculation Chemistry 1 Preparation: 2 Chemical Mix (High Flow) NSR Chemical 1 Temperature Mixing: Not Present: Local NSR Chemistry 1 Life Time Exp.: Top-up Chem. 1 Temp. Specification: 24-40C Chemical 1 Filter Preparation: Filter Housing Chem. 1 Gilter Catridge: Filter Pore Size 20nm Internal Chemical 1 AnalyzersL Horiba HF-960M External Chemical 1 Analyzers: Not present Chem 1 Analyzer Saple collerL Not Present EOS ES Media#2 Chemistry 2: Not present EOS ES Media#3 Chemistry 3: Not present EOS ES PM Chuck: DS Chuck (Std. & Solb. less than 60C) Drying: ASD3+ IPA Options: Standard IPA Filter Cartridge: Lam Spplied IPA Filter Partical Removal Options: A-Jet (DI/CO2) Drain Separation (Rinse Level): 3 Media Level 3- Drain#1: Rinse Medua (DI) Level 3- Drain#2: IPA- High Concentration Level 30 Drain#3: IPA- Low Concentration Exhaust Separation: BB-L1 & L2-Exh. 1, Le-Exh1,2 Media 1 Dispense Single Nozzle Media 2 Dispense: Single Nozzle OptionsL Continuos Wet Wafer Damage/Missing parts list Please inspect tool to reconfirmOEM Model Description
AUTOETCH 490, 590, 690 series for etching polysilicon, oxide and aluminum film applications, respectively.Documents
No documents
LAM RESEARCH CORPORATION
AUTOETCH 690
Verified
CATEGORY
Plasma Etch
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22365
Wafer Sizes:
12"/300mm
Vintage:
2015
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllLAM RESEARCH CORPORATION
AUTOETCH 690
CATEGORY
Plasma Etch
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
22365
Wafer Sizes:
12"/300mm
Vintage:
2015
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Single Wafer ProcessingConfiguration
Process: BACKETCH Tool config is based on original PO, please verify tool details at tool inspection FID: 157426 Tool S/N: E14 Reference Tool S/N: E6 EOS Product Type EOS Front Section ES EOS Rear Section ES Front End Load Port: 4 FOUP TDK Carrier ID: Brooks Carrier ID reader Factory Automation: OHT PIO Sensor User Interface Options: Side Only (Ballroom) Signal Tower: R-O-G-B Silm Line Handling system: Standard Handling Process Module Ionization: PM Ionixation 16 chamber Platform Doors: Door with Windows Okatform Lights: Wite LEDs Number of Power Supply Lines: 2 Supply Feed System Power Supply: 208V and 480V 50/60 Hz Interconnect Com. Cables: 30m Cab;es to Subpanel PC Power supply: Internal UPS Fire Suppression Front Section & Rear Section EOS ES Media#1 Chemistry 1: dHF (supply to TL) Chemistry 1 Dispense: double side dispense Chemistry 1 Dispense mode: Drain & recirculation Chemistry 1 Preparation: 2 Chemical Mix (High Flow) NSR Chemical 1 Temperature Mixing: Not Present: Local NSR Chemistry 1 Life Time Exp.: Top-up Chem. 1 Temp. Specification: 24-40C Chemical 1 Filter Preparation: Filter Housing Chem. 1 Gilter Catridge: Filter Pore Size 20nm Internal Chemical 1 AnalyzersL Horiba HF-960M External Chemical 1 Analyzers: Not present Chem 1 Analyzer Saple collerL Not Present EOS ES Media#2 Chemistry 2: Not present EOS ES Media#3 Chemistry 3: Not present EOS ES PM Chuck: DS Chuck (Std. & Solb. less than 60C) Drying: ASD3+ IPA Options: Standard IPA Filter Cartridge: Lam Spplied IPA Filter Partical Removal Options: A-Jet (DI/CO2) Drain Separation (Rinse Level): 3 Media Level 3- Drain#1: Rinse Medua (DI) Level 3- Drain#2: IPA- High Concentration Level 30 Drain#3: IPA- Low Concentration Exhaust Separation: BB-L1 & L2-Exh. 1, Le-Exh1,2 Media 1 Dispense Single Nozzle Media 2 Dispense: Single Nozzle OptionsL Continuos Wet Wafer Damage/Missing parts list Please inspect tool to reconfirmOEM Model Description
AUTOETCH 490, 590, 690 series for etching polysilicon, oxide and aluminum film applications, respectively.Documents
No documents