The LRC Rainbow Etchers are fully automated, in-line, single-wafer plasma/RIE etching systems that processes 6-inch, or 8-inch wafers and features top or/and bottom powered electrode plate, programmable electrode spacing, and automatic noncontact wafer alignment and placement. Unique RF match networks are located at the upper and lower electrodes for programmable switching between plasma and RIE modes. Designed for continuous operation, the LRC Rainbow etchers are computer-controlled, allowing either manual or automatic control. The Lam Rainbow 44XX Series can be for Tungsten silicide, Silicon nitride, polysilicon ,oxide, Crystallise Si etc.

LAM RESEARCH CORPORATION

RAINBOW 4420

The AutoEtch 490 is part of the AutoEtch family, which was Lam’s initial product line. The first AutoEtch product was sold in January 1982. The AutoEtch product line includes the 490, 590, and 690 series for etching polysilicon, oxide, and aluminum film applications, respectively. Despite being more than fourteen years old, continued improvements in both reliability and performance have enabled Lam to continue to offer the AutoEtch series as a suitable product for film applications involving line-widths of 0.8 micron or greater and wafer sizes of six inches or smaller. 

AUTOETCH 490

The Rainbow® 4520i system is a single wafer, vacuum load-locked low pressure oxide system with two active processing chambers. It is designed for integrated isotropic/anisotropic profile on high aspect ratio contact and via structures. The Isotropic Module adds isotropic oxide etching capabilities to the existing anisotropic capabilities of the Rainbow 4520, providing excellent aluminum step coverage. The Isotropic Module is incorporated onto the entrance load-lock on the Rainbow 4520, requiring only one additional wafer handling step. Having two chambers on a single machine greatly reduces the possibility of cross contamination between processes, which minimizes wafer breakage and defect densities. The system has a high uptime of ≥ 85% and is capable of isotropic etching for dielectric (oxide) films. The Rainbow® 4520i system has several applications, including contact etch, planarization, via etch, trench mask etch, and pad etch.

RAINBOW 4520i

The Rainbow 4520 is a state-of-the-art Silicon Dioxide Etching system that is fully automated and capable of processing wafers of various sizes, including 4-, 5-, 6-, and 8-inch wafers. This advanced system features a top powered electrode plate, programmable electrode spacing, and automatic wafer alignment and placement, ensuring precise and efficient etching. With its advanced capabilities, the Rainbow 4520 is an ideal solution for high-quality Silicon Dioxide Etching.

RAINBOW 4520

The AutoEtch 590 is part of Lam Research Corporation’s AutoEtch product line, which was first introduced in January 1982. The AutoEtch series includes the 490, 590, and 690 series, designed for etching polysilicon, oxide, and aluminum film applications, respectively. The AutoEtch 590 is suitable for film applications involving line-widths of 0.8 microns or greater and wafer sizes of six inches or smaller. Despite being over fourteen years old, the AutoEtch series has undergone continued improvements in both reliability and performance.

AUTOETCH 590

The Rainbow 4520XL is part of Lam Research’s Rainbow series of etch systems, introduced in 1987. This series addresses processes for wafers up to 200mm and feature sizes as small as 0.35 micron. The Rainbow product line includes the 4400, 4500, 4600, and 4700 series for etching polysilicon, oxide, aluminum, and tungsten films. These systems offer improved etch capability, reliability, and performance through unique features such as a patented wafer handling system and a proprietary source for generating stable plasma.

RAINBOW 4520XL

AUTOETCH 490, 590, 690 series for  etching polysilicon, oxide  and aluminum film applications, respectively. 

AUTOETCH 690

The Rainbow 4600 is part of the Rainbow series of etch systems, first introduced in 1987. This series of products addresses processes that utilize wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4600 is specifically designed for etching tungsten films. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow product series incorporates a number of unique features that offer semiconductor manufacturers improved etch capability, reliability, and performance. These features include a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design for which Lam has received industry awards for quality and reliability. These and other features of the Rainbow product are designed to enable the semiconductor manufacturer to reduce wafer particle contamination to a level that exceeds industry standards, and to improve etch selectivity and uniformity while maintaining profile control and process flexibility.

RAINBOW 4600

The 4520XLE system has a wide process flexibility that allows fabs to develop processes for multiple dual damascene structures and investigate how well each can integrate into the interconnect process. Its broad process window provides this flexibility through independently controlled power settings that regulate charged particle flux and energy along with a wide operating pressure range. The system is able to run high pressure processes in situ, such as photoresist strip and nitride finish etch, eliminating extra wafer handling steps. This in situ process capability lowers overall costs per wafer.

RAINBOW 4520XLe

RAINBOW 4720

The LAM Rainbow 4620 is a Etchers & Ashers system. The Rainbow 4620 can be used with 8” wafer sizes. Its installation type is a Bulkhead mount configuration. The LAM Rainbow 4620 has a Cassette Interface with Hine 38A Wafer Indexers Ergo-Loader Option and Dual Endpoint Detection.

RAINBOW 4620

The AutoEtch 480 system is a plasma etcher that offers a high level of automation through its Recipe™ Programming Module. This solid-state module is compact and easy to use, allowing for automatic entry of all process parameters, including flow rates, pressure, RF power, substrate temperature, and electrode spacing. This makes programming the AutoEtch 480 quick and simple.

AUTOETCH 480

RAINBOW 4470

The Rainbow 4500 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow series includes the 4400, 4500, 4600, and 4700 for etching polysilicon, oxide, aluminum, and tungsten films respectively. These systems are designed to accommodate evolving customer needs through hardware and process enhancements. The Rainbow series incorporates unique features that offer improved etch capability, reliability, and performance, including a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features are designed to enable semiconductor manufacturers to reduce wafer particle contamination to a level that exceeds industry standards and improve etch selectivity and uniformity while maintaining profile control and process flexibility.

RAINBOW 4500

 The AutoEtch product line includes the 490, 590, 690 and 790 series for etching polysilicon, oxide, aluminum and tungsten film, respectively. Although the AutoEtch series is more than fifteen years old, continued improvements in both reliability and performance have enabled Lam to continue to offer it as a suitable product for applications involving line widths of 0.8 micron or greater and wafer sizes of six inches or smaller.

AUTOETCH 790

CORONUS HP

RAINBOW 4420XL

Rainbow 4400,  4500,  4600  and  4700 series  for  etching  polysilicon,  oxide, aluminum  and  tungsten  films,  respectively. The Rainbow series of products addresses processes that utilize wafer sizes up to 200mm  and feature  sizes as small  as 0.35 micron. 

RAINBOW 4700

RAINBOW 4450

Rainbow 4400 is part of the Rainbow series of etch systems introduced in 1987. It addresses processes for wafer sizes up to 200mm and feature sizes as small as 0.35 micron. The Rainbow 4400 is designed for etching polysilicon films and incorporates unique features such as a patented wafer handling system, a proprietary source for generating stable plasma, and an overall product design that has received industry awards for quality and reliability. These features enable semiconductor manufacturers to reduce wafer particle contamination, improve etch selectivity and uniformity while maintaining profile control and process flexibility.

LAM RESEARCH CORPORATION

Overview

Active Listings

Total Products

Services

Top LAM RESEARCH CORPORATION Plasma Etch

RAINBOW 4420

AUTOETCH 490

RAINBOW 4520i

AUTOETCH 590

List it with Moov and find the perfect buyer in no time at all.

All LAM RESEARCH CORPORATION Plasma Etch