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PLASMATHERM LAPECVD
  • PLASMATHERM LAPECVD
  • PLASMATHERM LAPECVD
  • PLASMATHERM LAPECVD
Description
Deposition LAPECVD
Configuration
No Configuration
OEM Model Description
Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications. The LAPECVD™ platform can be used to deposit a variety of thin-film materials with its parallel-plate plasma deposition system. Hardware: -Cassette-to-Cassette Handling: - Multi-substrate batch processing -Dual cassettes -Platen heating up to 350°C -Upper electrode RF power at 13.56 MHz with optional MFD -Up to 8 gas channels with digital MFCs -Thermally managed reactor design—up to 175°C for internal walls and shower head
Documents

No documents

CATEGORY
PECVD

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

117124


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

PLASMATHERM

LAPECVD

verified-listing-icon
Verified
CATEGORY
PECVD
Last Verified: Over 60 days ago
listing-photo-09417df02a3a41e2a648d2d6fc12c3ae-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

117124


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Deposition LAPECVD
Configuration
No Configuration
OEM Model Description
Plasma-Therm’s LAPECVD™ (Large Area Plasma Enhanced Chemical Vapor Deposition) uses a cassette-to-cassette configuration to allow for high-volume production in a wide range of applications. The LAPECVD™ platform can be used to deposit a variety of thin-film materials with its parallel-plate plasma deposition system. Hardware: -Cassette-to-Cassette Handling: - Multi-substrate batch processing -Dual cassettes -Platen heating up to 350°C -Upper electrode RF power at 13.56 MHz with optional MFD -Up to 8 gas channels with digital MFCs -Thermally managed reactor design—up to 175°C for internal walls and shower head
Documents

No documents