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1. Process module (ICP-RIE Etch, PECVD) . Process Chamber Inside 2. Loadlock (outside & Inside) 3. Gas Supply (ICP-RIE Etch, PECVD) -Gas Supply (for ICP-RIE Etch) ✓ HBr 50sccm ✓ BCl3 50sccm ✓ Cl2 50sccm ✓ SF6 100sccm ✓ Ar 100sccm ✓ O2 100sccm -Gas Supply (for PECVD) ✓ 5%SiH4/N2 1000sccm ✓ NH3 50sccm ✓ N2O 2000sccm ✓ N2 2000sccm ✓ O2 200sccm ✓ CF4 500sccm 4. Chiller 5. Power Transfer 6. PC * Pump : not includedOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
OXFORD
PLASMALAB 100
Verified
CATEGORY
PECVD
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103544
Wafer Sizes:
Unknown
Vintage:
Unknown
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OXFORD
PLASMALAB 100
CATEGORY
PECVD
Last Verified: 8 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
103544
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available