Description
There are 3 main problems with the system: 1) Neither AMU is in working condition 2) There is an internal leak in the system, which we believe is coming from CDA and/or related to the slit valve. 3) The backing pumps have failed repeated, likely related to vacuum leak The status of parts on the tool: 1) ICP AMU – Installed, not working 2) RIE AMU – Not installed, but we have the original unit. The original unit does not work. 3) ICP Power Supply – Not installed. Unsure if working. 4) Endpoint detection system – Not installed. Unsure if working. 5) Backing pump – None, two prior pumps have failed 6) All other parts of the tool are present and installed. Besides the vacuum leak, all other parts were working at last shutdown.Configuration
Gases: -Process Delivery Line -CH4 – Methane -H2 – Hydrogen -CHF3 – Trifluoromethane -O2 – Oxygen -CF4 – Tetraflouromethane -Ar – Argon -N2 – Nitrogen -HBr – Hydrogen BromineOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
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OXFORD
PLASMALAB 100
Verified
CATEGORY
PECVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116201
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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OXFORD
PLASMALAB 100
CATEGORY
PECVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
116201
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
There are 3 main problems with the system: 1) Neither AMU is in working condition 2) There is an internal leak in the system, which we believe is coming from CDA and/or related to the slit valve. 3) The backing pumps have failed repeated, likely related to vacuum leak The status of parts on the tool: 1) ICP AMU – Installed, not working 2) RIE AMU – Not installed, but we have the original unit. The original unit does not work. 3) ICP Power Supply – Not installed. Unsure if working. 4) Endpoint detection system – Not installed. Unsure if working. 5) Backing pump – None, two prior pumps have failed 6) All other parts of the tool are present and installed. Besides the vacuum leak, all other parts were working at last shutdown.Configuration
Gases: -Process Delivery Line -CH4 – Methane -H2 – Hydrogen -CHF3 – Trifluoromethane -O2 – Oxygen -CF4 – Tetraflouromethane -Ar – Argon -N2 – Nitrogen -HBr – Hydrogen BromineOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents