Description
Oxford Plasmalab 100 ICP 180 RIE System 208V, 50/60Hz, w/ VAT PM-5 adaptive pressure controller, Adixen ACT 1300M turbopump controller. Thermo Neslab chiller, BOM#274103200000; Leybold D65BC vacuum pump w/ oil filter & exhaust filter; Anest Iwata Scroll Meister vacuum pump; OptiTemp OTI-5WL-P3-216 chiller; gas box; control computer LCD monitor; computer cart. 64in x 29in x 49in H.Configuration
No ConfigurationOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents
Verified
CATEGORY
PECVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
135814
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100
CATEGORY
PECVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
135814
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Oxford Plasmalab 100 ICP 180 RIE System 208V, 50/60Hz, w/ VAT PM-5 adaptive pressure controller, Adixen ACT 1300M turbopump controller. Thermo Neslab chiller, BOM#274103200000; Leybold D65BC vacuum pump w/ oil filter & exhaust filter; Anest Iwata Scroll Meister vacuum pump; OptiTemp OTI-5WL-P3-216 chiller; gas box; control computer LCD monitor; computer cart. 64in x 29in x 49in H.Configuration
No ConfigurationOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents