Description
ICP systemConfiguration
Dual power supplies/match Designed for high density PECVD of SiO2 and Si3N4 Can be doped with (PH3) for p-glassOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
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Verified
CATEGORY
PECVD
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152873
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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OXFORD
PLASMALAB 100 PECVD
CATEGORY
PECVD
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152873
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ICP systemConfiguration
Dual power supplies/match Designed for high density PECVD of SiO2 and Si3N4 Can be doped with (PH3) for p-glassOEM Model Description
The Oxford Plasmalab 100 is an inductively coupled plasma (ICP) etcher that is designed for multipurpose use. It is based on fluorocarbon and is capable of anisotropically etching silicon, silicon oxide, and other dielectric materials. The tool is equipped with a temperature-controlled electrode, which allows users to tailor their etch feature profiles. The manual load system can accommodate substrates of various sizes, ranging from 200mm diameter wafers down to small piecesDocuments
No documents