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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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KULICKE & SOFFA (K&S) APAMA C2S
    Description
    Chip-to-Substrate Thermo-Compression Bonder
    Configuration
    No Configuration
    OEM Model Description
    Advanced packaging, flip chip thermo-compression bonding applications.
    Documents

    No documents

    KULICKE & SOFFA (K&S)

    APAMA C2S

    verified-listing-icon

    Verified

    CATEGORY
    Packaging

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    106709

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    Packaging
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    Packaging
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    Packaging
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    KULICKE & SOFFA (K&S)

    APAMA C2S

    verified-listing-icon
    Verified
    CATEGORY
    Packaging
    Last Verified: Over 60 days ago
    listing-photo-a5bad1bf0ca14dd797f1b2b0f41aef64-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    106709

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Chip-to-Substrate Thermo-Compression Bonder
    Configuration
    No Configuration
    OEM Model Description
    Advanced packaging, flip chip thermo-compression bonding applications.
    Documents

    No documents

    Similar Listings
    View All
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    PackagingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    PackagingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    KULICKE & SOFFA (K&S) APAMA C2S

    KULICKE & SOFFA (K&S)

    APAMA C2S

    PackagingVintage: 0Condition: UsedLast Verified:Over 60 days ago