Description
Chip-to-Substrate Thermo-Compression BonderConfiguration
No ConfigurationOEM Model Description
Advanced packaging, flip chip thermo-compression bonding applications.Documents
No documents
KULICKE & SOFFA (K&S)
APAMA C2S
Verified
CATEGORY
Packaging
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101500
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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KULICKE & SOFFA (K&S)
APAMA C2S
CATEGORY
Packaging
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
101500
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Chip-to-Substrate Thermo-Compression BonderConfiguration
No ConfigurationOEM Model Description
Advanced packaging, flip chip thermo-compression bonding applications.Documents
No documents