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KULICKE & SOFFA (K&S) APAMA C2S
  • KULICKE & SOFFA (K&S) APAMA C2S
  • KULICKE & SOFFA (K&S) APAMA C2S
  • KULICKE & SOFFA (K&S) APAMA C2S
Description
Chip-to-Substrate Thermo-Compression Bonder
Configuration
No Configuration
OEM Model Description
Advanced packaging, flip chip thermo-compression bonding applications.
Documents

No documents

KULICKE & SOFFA (K&S)

APAMA C2S

verified-listing-icon

Verified

CATEGORY
Packaging

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

101500


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

KULICKE & SOFFA (K&S)

APAMA C2S

verified-listing-icon
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
listing-photo-26c117ad386d4968b025b4669e2fa6d9-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

101500


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Chip-to-Substrate Thermo-Compression Bonder
Configuration
No Configuration
OEM Model Description
Advanced packaging, flip chip thermo-compression bonding applications.
Documents

No documents