Description

No description

Configuration

Chip-to-Substrate Thermo-Compression Bonder

OEM Model Description

Advanced packaging, flip chip thermo-compression bonding applications.

Documents

No documents

KULICKE & SOFFA (K&S)

APAMA C2S

Verified

Packaging

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

62829

Wafer Sizes:

Unknown

Vintage:

Unknown

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Logistics Support

Available

Money Back Guarantee

Available

Transaction Insured by Moov

Available

Refurbishment Services

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KULICKE & SOFFA (K&S)

APAMA C2S

Packaging

Vintage: 0Condition: Used

Last VerifiedOver 30 days ago

KULICKE & SOFFA (K&S)

APAMA C2S

Packaging

Vintage: 0Condition: Used

Last VerifiedOver 30 days ago

KULICKE & SOFFA (K&S)

APAMA C2S

Packaging

Vintage: 0Condition: Used

Last VerifiedOver 60 days ago

KULICKE & SOFFA (K&S)

APAMA C2S

Verified

Packaging

Last Verified: Over 60 days ago

listing-photo-7780b9f90de64092a96ba13e6214edf1-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

62829

Wafer Sizes:

Unknown

Vintage:

Unknown

Logistics Support

Available

Money Back Guarantee

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

Description

No description

Configuration

Chip-to-Substrate Thermo-Compression Bonder

OEM Model Description

Advanced packaging, flip chip thermo-compression bonding applications.

Documents

No documents

Similar Listings

View All

KULICKE & SOFFA (K&S)

APAMA C2S

PackagingVintage: 0Condition: UsedLast Verified: Over 30 days ago

KULICKE & SOFFA (K&S)

APAMA C2S

PackagingVintage: 0Condition: UsedLast Verified: Over 30 days ago

KULICKE & SOFFA (K&S)

APAMA C2S

PackagingVintage: 0Condition: UsedLast Verified: Over 60 days ago