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BESI / FICO AMS-W40-306
    Description
    No missing, No HDD
    Configuration
    No Configuration
    OEM Model Description
    The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.
    Documents

    No documents

    BESI / FICO

    AMS-W40-306

    verified-listing-icon

    Verified

    CATEGORY
    Packaging

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    57373

    Wafer Sizes:

    Unknown

    Vintage:

    2011

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    Packaging
    Vintage: 2011Condition: Used
    Last VerifiedOver 60 days ago
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    Packaging
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    BESI / FICO

    AMS-W40-306

    verified-listing-icon
    Verified
    CATEGORY
    Packaging
    Last Verified: Over 60 days ago
    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/a92112e251234ae298e0b0eba46371c6_20220310164448_mw.jpg
    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/a60e3f18fe0d425597a5de39a18ba8cc_20220310164457_mw.jpg
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    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/4706eb4823f8430ebda9aadd92bcb14d_20220310164633_mw.jpg
    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/bbe5ee58920b42a18e476a0997c1c254_20220310164637_mw.jpg
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    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/30ab72fe048a48dd86bc927c2a5beb12_20220310164800_mw.jpg
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    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/1d18ed5bfa924ae8a9f03254c41d0374_20220310164812_mw.jpg
    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/cb5acfa8275f449b93784e4d6f8cc94b_20220310164859_mw.jpg
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    listing-photo-a9aab97db51943acbff32be04b02625b-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/44683/286a67f7e3954564ad4d938a76a1c278/763dbc82e2e7475686d426e1ab8a9855_20220310164913_mw.jpg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    57373

    Wafer Sizes:

    Unknown

    Vintage:

    2011

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No missing, No HDD
    Configuration
    No Configuration
    OEM Model Description
    The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.
    Documents

    No documents

    Similar Listings
    View All
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    PackagingVintage: 2011Condition: UsedLast Verified:Over 60 days ago
    BESI / FICO AMS-W40-306

    BESI / FICO

    AMS-W40-306

    PackagingVintage: 0Condition: UsedLast Verified:Over 60 days ago