Overview

The BESI FICO AMS-W40-306 is a molding system used in the semiconductor industry for molding semiconductor devices. The AMS-W40-306 is capable of both die bonding and flip chip bonding processes. The AMS-W40-306 includes advanced mechanisms for handling different types of substrates, such as lead frames, ceramic substrates, or other package types. The "W40" part may refer to a specific platform or series within the BESI FICO AMS product line.