Description
No descriptionConfiguration
TSV Cu AnnealOEM Model Description
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.Documents
No documents
CATEGORY
Oven
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117007
Wafer Sizes:
12"/300mm
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON / WAFERMASTERS
SAO-302LP
CATEGORY
Oven
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
117007
Wafer Sizes:
12"/300mm
Vintage:
2000
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
TSV Cu AnnealOEM Model Description
The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.Documents
No documents