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TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP
    Description
    OVEN
    Configuration
    TSV Cu Anneal
    OEM Model Description
    The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
    Documents

    No documents

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    verified-listing-icon

    Verified

    CATEGORY
    Oven

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    75747

    Wafer Sizes:

    12"/300mm

    Vintage:

    2000

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    Oven
    Vintage: 2000Condition: Used
    Last VerifiedOver 60 days ago

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    verified-listing-icon
    Verified
    CATEGORY
    Oven
    Last Verified: Over 60 days ago
    listing-photo-6cf9cd72db9a4e94bd14717229845f51-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/6cf9cd72db9a4e94bd14717229845f51/5078fa0e3a40478d92d8eaaeeb738e5a_fileutil_mw.jpg
    listing-photo-6cf9cd72db9a4e94bd14717229845f51-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/2205/6cf9cd72db9a4e94bd14717229845f51/054d0fe6b9784bde8031d5b8e798c5cc_fileutil1_mw.jpg
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    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    75747

    Wafer Sizes:

    12"/300mm

    Vintage:

    2000

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    OVEN
    Configuration
    TSV Cu Anneal
    OEM Model Description
    The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.
    Documents

    No documents

    Similar Listings
    View All
    TEL / TOKYO ELECTRON / WAFERMASTERS SAO-302LP

    TEL / TOKYO ELECTRON / WAFERMASTERS

    SAO-302LP

    OvenVintage: 2000Condition: UsedLast Verified:Over 60 days ago