The SAO-302LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.

TEL / TOKYO ELECTRON / WAFERMASTERS

SAO-302LP

The SAO-200LP system is designed based on a resistively heated, stacked process module technology to address ambient controlled, low temperature annealing applications up to 450°C. The system processes five wafers simultaneously and provides excellent process repeatability and stability at a minimum cost of ownership.

TEL / TOKYO ELECTRON / WAFERMASTERS

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SAO-302LP

SAO-200LP

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