Description
N&K 8000 CD Trench Depth & Thin film Measurement Fully Automated Thin Film Metrology System for Patterned and Unpatterned WafersConfiguration
Working DUV - Vis - NIR: 190nm to 1000nm Reflectance, Polarized Analyzer Unit with spot size : 50 um Cognex Pattern Recognition Software Windows 7 Operating System S/W Version : 10.5.3.0 n&k's Thin Film Characterization S/W n&k's Standard Films Library Automated Wafer Loading/Unloading Assyst Loadport for 8" Wafers Computerized X-Y stage for full wafer mapping, and wafer alignment capability Z-stage to accommodate multiple substrate thickness SEMI and CE Certification Application : Simultaneously determines thickness, n and k of thin films including semiconductors ,dielectronic (SiO2, Si3N4),etc, Polymers (Photoresist, etc),and very thin metals - Thin Film : Film Thickness / n and k - OCD : Depth / CD / ProfileOEM Model Description
None ProvidedDocuments
No documents
N & K
8000-CD
Verified
CATEGORY
Metrology
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21701
Wafer Sizes:
8"/200mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
N & K
8000-CD
CATEGORY
Metrology
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
21701
Wafer Sizes:
8"/200mm
Vintage:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
N&K 8000 CD Trench Depth & Thin film Measurement Fully Automated Thin Film Metrology System for Patterned and Unpatterned WafersConfiguration
Working DUV - Vis - NIR: 190nm to 1000nm Reflectance, Polarized Analyzer Unit with spot size : 50 um Cognex Pattern Recognition Software Windows 7 Operating System S/W Version : 10.5.3.0 n&k's Thin Film Characterization S/W n&k's Standard Films Library Automated Wafer Loading/Unloading Assyst Loadport for 8" Wafers Computerized X-Y stage for full wafer mapping, and wafer alignment capability Z-stage to accommodate multiple substrate thickness SEMI and CE Certification Application : Simultaneously determines thickness, n and k of thin films including semiconductors ,dielectronic (SiO2, Si3N4),etc, Polymers (Photoresist, etc),and very thin metals - Thin Film : Film Thickness / n and k - OCD : Depth / CD / ProfileOEM Model Description
None ProvidedDocuments
No documents