Description
E-BEAM INSPECTION CUConfiguration
No ConfigurationOEM Model Description
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.Documents
No documents
APPLIED MATERIALS (AMAT)
PROVision
Verified
CATEGORY
Metrology
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73724
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
APPLIED MATERIALS (AMAT)
PROVision
Verified
CATEGORY
Metrology
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73724
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
E-BEAM INSPECTION CUConfiguration
No ConfigurationOEM Model Description
The PROVision 3E system combines nanometer resolution, high speed, and through-layer imaging to produce the millions of datapoints needed to correctly pattern today’s most advanced designs, including 3nm foundry-logic chips, GAA transistors, and next-generation DRAM and 3D NAND. With these capabilities, it sees beyond the blind spots of optical metrology, performing accurate measurements across the wafer and between the many layers of a chip to generate the multidimensional data sets needed to achieve the best chip performance and accelerate time to market.Documents
No documents