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VEECO / ULTRATECH AP300
    Description
    No description
    Configuration
    Details attached below
    OEM Model Description
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    Documents

    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    Verified

    CATEGORY

    Lithography
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    67410


    Wafer Sizes:

    12"/300mm


    Vintage:

    2009

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    Refurbishment Services
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    VEECO / ULTRATECH AP300
    VEECO / ULTRATECHAP300Lithography
    Vintage: 2009Condition: Used
    Last VerifiedOver 30 days ago

    VEECO / ULTRATECH

    AP300

    verified-listing-icon

    Verified

    CATEGORY

    Lithography
    Last Verified: Over 60 days ago
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    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    67410


    Wafer Sizes:

    12"/300mm


    Vintage:

    2009


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Details attached below
    OEM Model Description
    The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.
    Documents
    Similar Listings
    View All
    VEECO / ULTRATECH AP300
    VEECO / ULTRATECH
    AP300
    LithographyVintage: 2009Condition: UsedLast Verified: Over 30 days ago
    VEECO / ULTRATECH AP300
    VEECO / ULTRATECH
    AP300
    LithographyVintage: 2009Condition: UsedLast Verified: Over 60 days ago
    VEECO / ULTRATECH AP300
    VEECO / ULTRATECH
    AP300
    LithographyVintage: 0Condition: UsedLast Verified: 21 days ago