Overview

The ULTRATECH AP300 is a stepper and scanner system that can produce wafers of 200-300mm in size. It is built on Veeco’s customizable Unity Platform™, which delivers superior overlay, resolution, and side wall profile performance, enabling highly automated and cost-effective manufacturing. The AP300 is particularly well-suited for copper pillar, fan-out, through-silicon via (TSV), and silicon interposer applications. It also has numerous application-specific product features to enable next-generation packaging techniques, such as enhanced warped wafer handling, dual side alignment, and optical focus.