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HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
  • HEIDELBERG INSTRUMENTS DWL 66
Description
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.
Configuration
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment Package
OEM Model Description
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.
Documents

No documents

CATEGORY
Lithography

Last Verified: Over 30 days ago

Key Item Details

Condition:

Used


Operational Status:

Installed / Running


Product ID:

115928


Wafer Sizes:

Unknown


Laser:
442

Vintage:

2002


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

HEIDELBERG INSTRUMENTS

DWL 66

verified-listing-icon
Verified
CATEGORY
Lithography
Last Verified: Over 30 days ago
listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/48ac06f4633b40a9b8314e68416a913b_7cb18b670abc4f90ba2d271bdd38904f45005c_mw.jpeg
listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/a549859fd8044908a3ce80d69a6bdc8c_36e9803a7a544fe9a890fd3917c4aa6845005c_mw.jpeg
listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/ae330c61ea7a4d3a9f6584fafacc8727_65e9682cc9df4ea8a9bc19cf8905c26b45005c_mw.jpeg
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listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/a287ee66139e4d5d9c95b6136fa44368_b624398918f44c478fd47b4694e396a645005c_mw.jpeg
listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/33b3b40fb4b6483bb0e094620f04bdf4_0188770118c44365b47b7739f1314da745005c_mw.jpeg
listing-photo-dcd152bdcb51493895fe99fcf24e3c4d-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/47810/dcd152bdcb51493895fe99fcf24e3c4d/9cf88f8e4e414b87ac1928047c83df9b_00bc01f02b7c4c92bf76de2bbc754cf445005c_mw.jpeg
Key Item Details

Condition:

Used


Operational Status:

Installed / Running


Product ID:

115928


Wafer Sizes:

Unknown


Laser:
442

Vintage:

2002


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
The Heidelberg Instruments DWL-66 is a versatile laser-based system designed for advanced mask production and wafer patterning. Utilizing a HeCd laser, it achieves fine resolution down to 800 nm through meticulous alignment and control of the laser optics. Fully operational and still installed.
Configuration
442 nm wavelength, 300 mW, HeCd laser (replaced in 2014, has around 4400 hours of usage) 4 mm write head 20 mm write head Flowbox Greyscale exposure Upgraded computer to Windows 7 in 2019 Metrology and Alignment Package
OEM Model Description
The DWL 66 is a precise, maskless laser lithography system for various applications like maskless lithography, photomask making, and direct writing. It supports gray-scale exposures on flat, photosensitive-coated materials. Key features include a minimum feature size of 0.6 microns, substrate size up to 200 x 200 mm, and over 1.0M dpi resolution using a 20-nanometer address grid.
Documents

No documents