Description
Vertical Batch Thermal Processing SystemConfiguration
Details Attached Process: HIGH TEMP OXIDE (HCL,AR) General Information: System Layout: Main, Utility System Type: L Type Side Maintenance: Installed System Paint Color: Ivory Furnace Front Surface Finish: Ivory Rapid Cooling Unit: Not Installed N2 Load Lock: Not Installed O2 Analyzer: Not Installed Cassette I/O Type: Normal I/O Type (NOT SMIF) SMIF Maker/Model: Not Installed AGV Compatibility: Unable System Main Controller: WAVES Mechanical Controller: WAVES Sequence Controller: WAVES Gas Controller: WAVES Gas Flow Chart Panel: Installed (Front, Rear) Operation Panel: Installed (Front, Rear) Signal Tower / Colors: Not Installed Furnace Temperature Controller: Model 560A Furnace Overtemp Detector: FENWAL / DMR-5FR Gas Detector Maker / Model: Yes Host Communications: SECS Gas System: Process Gas: N2, O2, H2, HCL, AR Basic Style: Integrated Gas System (Fujikin) Manual Valve: NUPRO Air-Operated Valve: FUJIKIN Filter: MILLIPORE Regulator: VERIFLO MFC Maker / Model: STEC (7330, 7350, 7500) PT Sensor Maker / Model: VERIFLO DPM Maker / Model: VERIFLO Check Valve: NUPRO Liquid Source Auto-Refill: N/A Burn Controller: HEC PYRO CTL Vacuum & Exhaust System: Pump: N/A Pressure Control Valve: N/A Pressure Controller: N/A Pressure Sensor: N/A Trap: Not Installed Gas Cooler: N/A Wafer and Cassette Handling: Wafer Type: 200 mm Notch Type Auto Wafer Aligner: Installed (QTY 26) Wafer in Cassette (QTY 21) Cassette Storage Fork Type: 1+4 Fork-Wafer Presence Sensor: Installed Fork-Variable Pitch: Installed Magnetic Seal Rotation: Not InstalledOEM Model Description
The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.Documents
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
157197
Wafer Sizes:
8"/200mm
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
ALPHA-8SE
CATEGORY
Furnaces / Diffusion
Last Verified: Yesterday
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
157197
Wafer Sizes:
8"/200mm
Vintage:
2002
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available