Description
Missing parts: M560/UPS/ hot exhaust duct/ capacitor/ SCR ignition board/ cover plate/ TC JUNGLE/ valve boxConfiguration
TEL ALPHA 8SE- Z TEOSOEM Model Description
The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.Documents
No documents
TEL / TOKYO ELECTRON
ALPHA-8SE
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115163
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
TEL / TOKYO ELECTRON
ALPHA-8SE
CATEGORY
Furnaces / Diffusion
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
115163
Wafer Sizes:
Unknown
Vintage:
2000
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Missing parts: M560/UPS/ hot exhaust duct/ capacitor/ SCR ignition board/ cover plate/ TC JUNGLE/ valve boxConfiguration
TEL ALPHA 8SE- Z TEOSOEM Model Description
The Alpha-8SE is a batch thermal processing system that covers multiple applications over a wide temperature range. It was introduced for 200mm wafer processing in the mid-1990s and has undergone continuous improvements to productivity, reliability, and stability. The Alpha-8SE supports 100/150/200mm wafer sizes and up to 150 wafer batch size for semiconductor thin film applications including oxidation & anneal, LPCVD of Si (Poly, a-Si), Si3N4, SiO2, and high-k ALD. It enables performance for today’s most advanced diffusion and deposition processes such as ALD (Atomic Layer Deposition), low-pressure radical oxidation, and low-temperature nitrides.Documents
No documents