Description
No descriptionConfiguration
Vacuum Soldering System Machine is not working for unknown reason.OEM Model Description
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.Documents
No documents
CENTROTHERM
VLO 300
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
54228
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CENTROTHERM
VLO 300
CATEGORY
Furnaces / Diffusion
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
54228
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Vacuum Soldering System Machine is not working for unknown reason.OEM Model Description
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.Documents
No documents