Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.Documents
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CENTROTHERM
VLO 300
Verified
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68827
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CENTROTHERM
VLO 300
CATEGORY
Furnaces / Diffusion
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
68827
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The VLO 300 is a vacuum soldering system designed for high volume production facilities. It can handle various materials up to 750°C and has integrated heating and cooling plates that can be individually controlled. The system is capable of reducing the soldered area affected by voids to less than 2%, compared to the typical 20% range of reflow soldering systems. It is suitable for fluxless and voidless soldering processes with various gas atmospheres, including N2, H2 100, and N2/H2 95/5. Chemical activation with HCOOH for ultra-clean soldering joints is also available as an option. The system can even use lead-free paste or pre-forms without additional flux. The process control computer features a user-friendly touch screen for operation, process profile editing, and recipe storage. It also has Ethernet and USB interfaces for connecting to printers, external storage devices, and remote access.Documents
No documents