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TERADYNE IP750Ex
  • TERADYNE IP750Ex
  • TERADYNE IP750Ex
  • TERADYNE IP750Ex
Description
No description
Configuration
No Configuration
OEM Model Description
The IP750Ex is a cost-effective image sensor test solution developed by Teradyne. It offers high throughput with dual core DSP and high speed data transfer at 10Gbps per instrument parallel, and can test up to 32 sites in parallel with 1024 digital pin configuration. It has broad device coverage, with the ability to test devices ranging from VGA to 32M pixels, and strong SOC test capability with the new HSD200 digital instrument. The IP750Ex is built on Teradyne’s J750 test platform, and is compatible with IP750EP/EMP test programs.
Documents

No documents

PREFERRED
 
SELLER
CATEGORY
Final Test

Last Verified: Over 60 days ago

Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

112164


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PREFERRED
 
SELLER

TERADYNE

IP750Ex

verified-listing-icon
Verified
CATEGORY
Final Test
Last Verified: Over 60 days ago
listing-photo-8b40e6493a65418a8301987e5cd3542a-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Buyer pays 12% premium of final sale price
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

112164


Wafer Sizes:

Unknown


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
No Configuration
OEM Model Description
The IP750Ex is a cost-effective image sensor test solution developed by Teradyne. It offers high throughput with dual core DSP and high speed data transfer at 10Gbps per instrument parallel, and can test up to 32 sites in parallel with 1024 digital pin configuration. It has broad device coverage, with the ability to test devices ranging from VGA to 32M pixels, and strong SOC test capability with the new HSD200 digital instrument. The IP750Ex is built on Teradyne’s J750 test platform, and is compatible with IP750EP/EMP test programs.
Documents

No documents