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This single-wafer, multi-chamber etcher is for dry etching and DDA plasma etch. The TEL UNITY IIE features ceramic church hardwares, ENI special automation matching networks, high temperature chiller, pressure monitors, ENI RF generators, SEIKO SEIKI pumps, and multi blade mechanical robotics for 8” wafer processing. Its process configuration includes 2 cassette chambers (N2), transfer chamber (N2), 2 process chambers (N2, O2, Ar, CF4, C4F6, C4F8, CHF3), and PA Chamber (N2). Unity 2e was a more advanced Unity II with hardware and software improvements.

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