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LAM RESEARCH / NOVELLUS SABRE
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    Documents

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    verified-listing-icon

    Verified

    CATEGORY
    Electro Plating

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Deinstalled


    Product ID:

    128986


    Wafer Sizes:

    12"/300mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro Plating
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    LAM RESEARCH / NOVELLUS

    SABRE

    verified-listing-icon
    Verified
    CATEGORY
    Electro Plating
    Last Verified: Over 60 days ago
    listing-photo-9ee9afab9acd45ec924f57211489c6cd-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Deinstalled


    Product ID:

    128986


    Wafer Sizes:

    12"/300mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    SABRE has been proven to provide void-free copper fill of sub-0.15 micron trench features (at 9 or 10:1 aspect ratios) and 0.25 micron vias (at 5:1 aspect ratios). SABRE employs a proprietary electrofilling cell that eliminates the backside wafer contamination of copper, and features a unique plating cell design that ensures reproducibility of the copper fill, with a film uniformity of 3 sigma, [5% with a wafer. SABRE requires only two types of process modules to complete the electrofill process, for electrofilling (3 stations total) and the other for spin/rinse/dry (another 3 stations). The resulting simplicity of this design is key to the system's high reliability and manufacturing availability.
    Documents

    No documents

    Similar Listings
    View All
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro PlatingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro PlatingVintage: 0Condition: UsedLast Verified:Over 60 days ago
    LAM RESEARCH / NOVELLUS SABRE

    LAM RESEARCH / NOVELLUS

    SABRE

    Electro PlatingVintage: 2008Condition: UsedLast Verified:Over 60 days ago