
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.Documents
No documents
Verified
CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
128993
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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CATEGORY
Electro Plating
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled
Product ID:
128993
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.Documents
No documents