Description

ECD (Electro Chemical Deposition) Asset HDD not included Module Details Fixloader TDK (v9.2) Nonmapping, moving nozzlew/ nitrogen purgedFOUPs – 3 LPs Control PC’s 2 proteus PC’s,Chase & main FFU SABRE FFU and SABRE ANL FFU Front End Robot Vortex with traverser to access 3 LPs Back End Robot Vortex Max Transfer Module RTM Load Locks for VPM Inbound and outbound loadlocks VPM One plasma chamber with 4 pedestals and two plasmasources Anneal Chambers 5 chambers Gas Box Hot Plate Cold Plate Carrier arm (Forkcarrier) Aligner Station Vortex Aligner Transfer Station Transfer Station Plating Cell VAN assy on Sabre Extremeplating cell Anode chamber SAC – separated anode chamber Charge plate Membrane Cationic membrane HRVA plate dHRVA Insert Insert is in cell, mountedabove HRVA Clamshell Vacuum/pressure clamshell Optical open sensor Vacuum close sensor Cone 2 wiper sealsfor use withvacuum/ pressure drive Cone pusher assy backside O-ring Cylinder Large shaft cylinder Cup Cup assembly Lift Controller Sel G liftcontroller AAE AAE assy’s - Cel1, Cell2/3 Robot Motor Controller Bearings IDEC Box No smart relaybox. Vacuum levelclose sensor used PEM O-ring stylePEM chuck EBR arm nozzle PEM controllers PEM motor spindles Dosing system Dosing systemhardware and controls; Dosing control Dosing system PNL NOWPAK Dosingsystem kit CDM Module CDM module, Syringe controllers. Flow switches &Valves; Chem Dilution Mod Assy CDM module plumbing kit CDM sensor kit Bath Module PS Reservoir Assy Ultrasonic Level Sensor PVDF HeatExchanger/ Dual PVDF Heat Exchangers for newer toolsor upgrades Plating Pumps Plating pump Flow meters Invertor Frequency invertor used where applicable Aspirator Pump Diaphragm pump Heater/ Chiller HX300, TF10000 SIOCs SIOC’s; Wafer Wand Bath Plating Post-plating Anneal Controllers 1x System controller 3x Module controllers (one Node for VPM portionof tool) AFA controller E -Net 2 E-net hubs and cablingsetup CCB PULST Plating assy AE PPS Power supply: E-WaveI or E-Wave II

Configuration

No Configuration

OEM Model Description

The NOVELLUS SABRE xT is a tool used for electrofilling that is part of the second generation of SABRE tools. It is designed to provide void-free fill in 0.13-micron geometries with aspect ratios up to 10:1. The SABRE xT is a “bridge tool” that can process either 200 or 300 mm wafers. It incorporates process enhancements in the areas of electrical waveforms, advanced bath chemistries, and automated chemical monitoring and control using Novellus’ proprietary SmartDose algorithm. The SABRE xT can process up to 75 wafers per hour and has achieved within-wafer uniformity performance of less than 2% 1 sigma and wafer-to-wafer uniformity of less than 1% 1 sigma in a production environment.

Documents

No documents

LAM RESEARCH / NOVELLUS

SABRE xT

Verified

Electro Plating

Last Verified: Over 30 days ago

Key Item Details

Condition:

Used

Operational Status:

Deinstalled / Crated

Product ID:

135489

Wafer Sizes:

12"/300mm

Vintage:

Unknown

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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