Description
Plator Off Status: COLD Deminsion (cm): 482x165x233 Weight kg: 2,000.00 2F Rigging (Yes or No): Yes Missing parts: Robot assy . robot controller board . spin motor . spin amplifier . lift motor . lift amplifier .liftrotate assy rotate amplifier .wip amplifier .flow pump . bowl seal. EPO power supply . 208V power supply Includes: Heater, chiller, power supplyConfiguration
No ConfigurationOEM Model Description
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.Documents
No documents
CATEGORY
Electro Plating
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136217
Wafer Sizes:
12"/300mm
Vintage:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER ECD-312
CATEGORY
Electro Plating
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136217
Wafer Sizes:
12"/300mm
Vintage:
2008
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Plator Off Status: COLD Deminsion (cm): 482x165x233 Weight kg: 2,000.00 2F Rigging (Yes or No): Yes Missing parts: Robot assy . robot controller board . spin motor . spin amplifier . lift motor . lift amplifier .liftrotate assy rotate amplifier .wip amplifier .flow pump . bowl seal. EPO power supply . 208V power supply Includes: Heater, chiller, power supplyConfiguration
No ConfigurationOEM Model Description
The Raider ECD is a system for 150mm-300mm single-wafer, automated, multi-chamber, electrochemical deposition that delivers high throughput in a small footprint. Electroplating on 300mm wafers employs an enhanced chamber reactor that is able to dynamically change the current density for unmatched uniformity. Some benefits of using the Raider ECD system include its ability to electroplate on ultra-thin and resistive seed layers through a multi-zone anode array. The system also saves on costs by using ionic membranes to extend chemistry life and “no teach” precision automation to eliminate automation re-teach down-time.Documents
No documents