Description
Make/Model ：EPLT/ECD 304 Specifications: Cu：CFDIII M or Raptor M Ni：CFD III Snag：CFDIII M or Raptor M - General statement of condition 1. Chamber by Amat/semitool Raider tool 2. Fac and Flow same as Raider 3. Electric and software make by EPLTConfiguration
No ConfigurationOEM Model Description
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.Documents
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CATEGORY
Electro Plating
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150426
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT) / SEMITOOL
RAIDER S ECD
CATEGORY
Electro Plating
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
150426
Wafer Sizes:
12"/300mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Make/Model ：EPLT/ECD 304 Specifications: Cu：CFDIII M or Raptor M Ni：CFD III Snag：CFDIII M or Raptor M - General statement of condition 1. Chamber by Amat/semitool Raider tool 2. Fac and Flow same as Raider 3. Electric and software make by EPLTConfiguration
No ConfigurationOEM Model Description
The Raider-S ECD is a high-volume single-wafer electroplating tool designed for Through-Silicon Via (TSV) and Wafer Level Packaging (WLP) applications. It features a precision, fully automated wafer handling system coupled with individual process chambers and is compatible with automated chemical management systems. The Raider-S ECD offers advanced metal deposition or clean chambers, with the option of 15 to over 27 process chambers. It also incorporates chemical analysis options, membrane plating technology, and a multi-zone anode for thinned seed plating. The Raider-S ECD has a small footprint and is available in 200mm or 300mm wafer sizes. Its applications include electrolytic metal deposition, such as Cu-TSV, Pillar, and SnAg bumping. With its advanced features and capabilities, the Raider-S ECD is a powerful tool for advanced semiconductor manufacturing.Documents
No documents