Description
OXIDE ETCHERConfiguration
No ConfigurationOEM Model Description
The UNITY® IIe is a plasma etch system designed to achieve excellent cost performance for the 130nm design rule and future technology generations. It is one of the various platforms of the UNITY® series, which also includes the M and Me models, each designed for specific applications to achieve higher productivity and reliability. The UNITY® IIe delivers world-class process results on a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It features PE (IIe), IEM (IIe), DRM and SCCM™ chambers, and is available in 84, 85 and 88 models. The system boasts high throughput, a compact design, lower CoO, and ease of maintenance. The Me model also includes a Flow Control System. With its advanced features and capabilities, the UNITY® IIe is a powerful tool for achieving optimal process results.Documents
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TEL / TOKYO ELECTRON
UNITY IIE 855SS
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102672
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
UNITY IIE 855SS
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102672
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
OXIDE ETCHERConfiguration
No ConfigurationOEM Model Description
The UNITY® IIe is a plasma etch system designed to achieve excellent cost performance for the 130nm design rule and future technology generations. It is one of the various platforms of the UNITY® series, which also includes the M and Me models, each designed for specific applications to achieve higher productivity and reliability. The UNITY® IIe delivers world-class process results on a wide range of plasma etch applications, including HARC, Dual Damascene, low-k dielectrics, poly gate, and shallow trench etch. It features PE (IIe), IEM (IIe), DRM and SCCM™ chambers, and is available in 84, 85 and 88 models. The system boasts high throughput, a compact design, lower CoO, and ease of maintenance. The Me model also includes a Flow Control System. With its advanced features and capabilities, the UNITY® IIe is a powerful tool for achieving optimal process results.Documents
No documents