We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
Plasma-Therm Versaline DSE-III (Deep Silicon Etcher) single chamber with single wafer semi-auto load lock -Operational -GUI PC and CTC PC in e-rack are not working.Configuration
- Application: deep silicon etch - Substrate size: 4”,6”,8”. Mechanical clamp -40C..+40C with Affinity chiller - Semi-auto load lock, single wafer - Plasma-Therm ICP-II DSE 3-turn source - 3.5kW, 2MHz ICP RF package (5kW limited to 3.5kW) - High-Speed Process Modulation w/ 1-100kHz DBS RF package for DSE - Heated chamber 180C - Optical End Point Detection - Gas box with 4 lines (C4F8, SF6, Ar, O2. 400/600/50/50sccm) - Fast gas switching option for DSE - User terminal mobile cart - Edwards ih80 dry pump - Edwards xds35i load lock dry pump - Edwards 1300l/s STPA turbo - 380VAC 3 phase (with transformer) - Low Maintenance Package - Through-wall panel is not includedOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112707
Wafer Sizes:
4"/100mm, 6"/150mm, 8"/200mm
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
PLASMATHERM
VERSALINE ETCH
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112707
Wafer Sizes:
4"/100mm, 6"/150mm, 8"/200mm
Vintage:
2012
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Plasma-Therm Versaline DSE-III (Deep Silicon Etcher) single chamber with single wafer semi-auto load lock -Operational -GUI PC and CTC PC in e-rack are not working.Configuration
- Application: deep silicon etch - Substrate size: 4”,6”,8”. Mechanical clamp -40C..+40C with Affinity chiller - Semi-auto load lock, single wafer - Plasma-Therm ICP-II DSE 3-turn source - 3.5kW, 2MHz ICP RF package (5kW limited to 3.5kW) - High-Speed Process Modulation w/ 1-100kHz DBS RF package for DSE - Heated chamber 180C - Optical End Point Detection - Gas box with 4 lines (C4F8, SF6, Ar, O2. 400/600/50/50sccm) - Fast gas switching option for DSE - User terminal mobile cart - Edwards ih80 dry pump - Edwards xds35i load lock dry pump - Edwards 1300l/s STPA turbo - 380VAC 3 phase (with transformer) - Low Maintenance Package - Through-wall panel is not includedOEM Model Description
None ProvidedDocuments
No documents