Description
Process chamberConfiguration
No ConfigurationOEM Model Description
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.Documents
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APPLIED MATERIALS (AMAT)
CENTURA MxP
Verified
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111683
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
CENTURA MxP
CATEGORY
Dry / Plasma Etch
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111683
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Process chamberConfiguration
No ConfigurationOEM Model Description
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.Documents
No documents