
Description
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and doorConfiguration
No ConfigurationOEM Model Description
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.Documents
No documents
CATEGORY
Dry / Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
139659
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllAPPLIED MATERIALS (AMAT)
CENTURA MxP
CATEGORY
Dry / Plasma Etch
Last Verified: 18 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
139659
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
• MxP etch chamber • Uni-body wall • Uni-lid 0020-31831 • Extended cathode ESC process kit • 1 torr process manometer • Heated pumpstack with VAT gate valve HRTV throttle • 0040-31911 ESC cathode • RF match 0010-12090 • Edward turbo (requires overhaul) • Magnet driver • Turbo controller and cable • Slit actuator and doorConfiguration
No ConfigurationOEM Model Description
This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.Documents
No documents