Description

No description

Configuration

POLY-ETC

OEM Model Description

This multi-chamber machine consists of one central transfer module with a magnetic vacuum robot surrounded by multiple processing stations and chambers. Chambers types include: MXP+, MXP Poly, and orienters. Applications of Centura MXP include etch, CVD, ALD, epitaxy, photomask fabrication, plasma doping, plasma nitridation, PVD, and RTP. In July 1994, Applied Materials introduced the Metal Etch MxP Centura, which combines sub-0.5 micron process technology with improved throughput.

Documents

No documents

APPLIED MATERIALS (AMAT)

CENTURA MxP

Verified

Dry / Plasma Etch

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used

Operational Status:

Unknown

Product ID:

127342

Wafer Sizes:

8"/200mm

Vintage:

2000

Logistics Support

Available

Transaction Insured by Moov

Available

Refurbishment Services

Available

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