AD838
Overview
The ASM AD838 is an automatic high-speed epoxy die bonder designed for efficiently bonding high-density lead frames, such as QFN, TQFP, PLCC, TSSOP, TSOP, SOT, and other similar packages. This die bonder is optimized for fast and accurate die bonding processes, making it ideal for semiconductor assembly applications requiring precise and reliable placement of dies on various lead frame types.
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AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 30 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: 2012Condition: UsedLast VerifiedOver 60 days ago
ASM
AD838
Die Bonders / Sorters / AttachersVintage: 2014Condition: UsedLast VerifiedOver 60 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days agoASM
AD838
Die Bonders / Sorters / AttachersVintage: Condition: UsedLast VerifiedOver 60 days ago